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Market Updates   News & Trends Smart phones fire up Japan mobile market (2009-08-27) [ RF/Wireless Design ] More firms want a slice of auto electronics market (2009-08-27) [ Power Design ] HTC, China Mobile partner on TD-SCDMA (2009-08-27) [ RF/Wireless Design ] Malaysia library system gets RFID-upgrade (2009-08-27) [ Security Design ] Powertech takes over Spansion's Suzhou facility (2009-08-27) [ Process/Manufacturing ] Taiwan steps-up optoelectronics, PV initiatives (2009-08-27) [ Process/Manufacturing ] Group to plug Ethernet into cars, professional media (2009-08-27) [ RF/Wireless Design ] Better information builds 'smarter' smart grids (2009-08-26) [ Power Design ] Energy efficiency drive hikes digital power IC market (2009-08-26) [ Power Design ] New process rolls ultrathin inorganic LEDs (2009-08-26) [ Optical Electronics and Display ] TSMC injects low-power process into 28nm roadmap (2009-08-26) [ Process/Manufacturing ] ReneSola gets green light on Wuzhong project (2009-08-26) [ Power Design ] Analysis: Chip startups feel the crunch (2009-08-26) [ Process/Manufacturing ] Bosch beefs up MEMS biz with Akustica acquisition (2009-08-25) [ Sensor Technology ] First Solar, SCE deliver 550MW PV electricity (2009-08-25) [ Power Design ] Southeast Asia mobile subscribers top 453M (2009-08-25) [ RF/Wireless Design ] Trio drives MEMS for aerospace, defense (2009-08-25) [ Sensor Technology ] Taiwan to boost auto electronics market (2009-08-25) [ Optical Electronics and Display ] Vietnam IC manufacturing hits roadblocks (2009-08-25) [ Process/Manufacturing ] Japan's Navitime tops Navteq APAC LBS Challenge (2009-08-24) [ RF/Wireless Design ] Tata, Tyco complete Tgn-Intra Asia cable system (2009-08-24) [ Network Design ] Analyst warns of image sensor market slide (2009-08-24) [ Optical Electronics and Display ] Outsourced IC design growth slowed 20% in '08 (2009-08-24) [ EDA ] Fujitsu, Furukawa push optical networks (2009-08-21) [ Optical Electronics and Display ] IBM, VCs boost Brazil digital infrastructure (2009-08-21) [ Process/Manufacturing ] APAC fixed broadband lines to reach 182M this year (2009-08-21) [ RF/Wireless Design ] Experts take on NAND, SSD issues (2009-08-21) [ Buffer/Storage ] Analyst: HP results spark hope for chipmakers (2009-08-21) [ Process/Manufacturing ] Infineon stays on top of power IC market (2009-08-20) [ Power Design ] Taiwan injects $1.4B in green energy industry (2009-08-20) [ Optical Electronics and Display ] CEVA brings HD audio in Sunplus Blu-ray SoCs (2009-08-20) [ EDA ] Virage Logic to buy ARC for $41M (2009-08-20) [ EDA ] SanDisk CEO offers NAND forecast (2009-08-20) [ Buffer/Storage ] Zinc oxide nanospears boost solar cell efficiency (2009-08-19) [ Process/Manufacturing ] Bangladesh gets solar-powered base stations (2009-08-19) [ RF/Wireless Design ] NI, SolidWorks co-develop mechatronics prototype tool (2009-08-19) [ EDA ] IBM taps DNA scaffolding to build tiny circuit boards (2009-08-19) [ Process/Manufacturing ] Trade group remains dubious of Taiwan DRAM plans (2009-08-19) [ Process/Manufacturing ] Regulations may hinder UMC's China foundry buyout (2009-08-18) [ Process/Manufacturing ] Oversupply to hurt solar market until 2012 (2009-08-18) [ Process/Manufacturing ] Navteq expands LBS challenge reach (2009-08-18) [ RF/Wireless Design ] Mentor to build design center in Saudi Arabia (2009-08-18) [ EDA ] Ferroelectric memories exceed DRAM, flash (2009-08-18) [ Buffer/Storage ] Intel Vietnam IC-assembly ramp hits snags (2009-08-18) [ Test & Packaging ] Synterra deploys ECI's XDM-3000 MSPP (2009-08-17) [ RF/Wireless Design ] Asia Pacific to host 39% of world's cell towers by 2014 (2009-08-17) [ RF/Wireless Design ] Altera, Peking U open joint EDA/SOPC Lab (2009-08-17) [ EDA ] Intersil, Tower ink power management deal (2009-08-17) [ Process/Manufacturing ] Micron: NAND scaling to continue (2009-08-17) [ Buffer/Storage ] TSMC invests $50M on solar plans (2009-08-17) [ Power Design ]    For the latest News & Trends, please click here.

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